9
Tried a new thermal paste method on a gaming rig and the temps dropped 15 degrees
I used the pea method on a Ryzen 7 for years, but last month I switched to the spread method with a plastic card on a similar build. The spread gave way better contact and the CPU now idles at 35C instead of 50C. Which paste method do you guys think is best for modern chips?
3 comments
Log in to join the discussion
Log In3 Comments
john50619d ago
You mentioned the spread method giving better contact and that's the key point. Modern chips have heat spreaders with tiny gaps that the pea method can miss. Spreading it thin with a card covers the whole surface evenly. I switched to spreading after seeing thermal images of bad coverage with the pea. It takes an extra minute but you get full contact every time. For any chip made in the last five years, spreading is just smarter.
5
andrew_shah19d ago
Exactly, those thermal images don't lie. Saw the same thing and it convinced me. The pea method leaves dry spots on modern IHS designs. I spread it now every single time. Used to get weird temp spikes before. Now temps are even and solid. Just a thin layer with a card makes all the difference.
5